Specific Process Knowledge/Thin film deposition: Difference between revisions

@@ Line 7: / Line 7: @@
 *Nickel
-=== Dielectric materials ===
+=== Polymers ===
+*SU8
+=== Other materials ===
+*PolySilicon
 *Silicon oxide
 *Silicon nitride
-=== Other materials ===
-*PolySilicon
+== Choose deposition equipment ==
+*Alcatel - ''E-beam evaporator and sputter tool''
+*Leybold - ''E-beam evaporator and multiple wafer tool''
+*Wordentec - ''Metal evaporator and ?''
+*PECVD - ''Plasma Enhanced Chemical Vapor deposition''
+*B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid''
+*B3 Furnace LPCVD TEOS - ''Deposition of silicon oxide''
+*B4 Furnace LPCVD PolySilicon - ''Deposition of polysilicon''
+*MVD - ''Molecular Vapor Deposition''