Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/ | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Hardness_measurement click here]''' | ||
==Thickness measurer== | ==Thickness measurer== | ||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px| | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | ||
The purpose is to measure | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | |||
'''The user manual, technical information and contact information can be found in LabManager:''' | '''The user manual, technical information and contact information can be found in LabManager:''' | ||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach= | '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | ||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== | ||
| Line 16: | Line 18: | ||
|- | |- | ||
| | | | ||
The measured standard thickness is 0.1 mm. The QC is | The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. | ||
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach= | *[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br> | ||
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br> | |||
|} | |} | ||
| Line 30: | Line 32: | ||
Purpose | Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
Hardness measurer | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Wafer thickness | *Wafer thickness | ||
Revision as of 13:41, 19 January 2018
Feedback to this page: click here
Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
|
Purpose |
Hardness measurer |
|
|---|---|---|
|
Performance |
Thickness resolution |
|
|
Substrates |
Batch size |
|
| Substrate materials allowed |
|