Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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==Thickness measurer==
==Thickness measurer==
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]]
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Hardness Measurer. Positioned in cleanroom F-2]]


The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
The purpose is to measure hardness of samples or films.  
 
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.  




'''The user manual, technical information and contact information can be found in LabManager:'''
'''The user manual, technical information and contact information can be found in LabManager:'''


'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=xxx Hardness measurer]'''


==Quality Control - Recipe Parameters and Limits==
==Quality Control - Recipe Parameters and Limits==
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The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.
The measured standard thickness is 0.1 mm. The QC is performed x times a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=xxx The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
 
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Revision as of 13:24, 19 January 2018

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Thickness measurer

Hardness Measurer. Positioned in cleanroom F-2

The purpose is to measure hardness of samples or films.


The user manual, technical information and contact information can be found in LabManager:

Hardness measurer

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The QC is performed x times a year.


Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger mesas

Performance

Thickness resolution

  • < 5 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions