Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
No edit summary |
|||
| Line 19: | Line 19: | ||
*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]] | *[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]] | ||
| |||
| |||
| |||
| |||
== Flip-chip bonder (glue attachment) == | == Flip-chip bonder (glue attachment) == | ||