Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]] | *[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]] | ||
== Flip-chip bonder (glue attachment) == | |||
[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in Danchip's Packlab building 347, 1. floor.]] | [[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in Danchip's Packlab building 347, 1. floor.]] | ||
The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate. | The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate. | ||