Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page--> | <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page--> | ||
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]] | |||
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]] | |||
== Die bonder (eutectic metal soldering) == | == Die bonder (eutectic metal soldering) == | ||
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | ||