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The user manual, APV, technical information and contact information can be found in LabManager:

Purpose	Deposition of metals and silicon	Thermal evaporation of metals
Performance	Film thickness	10Å - 1µm* (for some materials)
Performance	Deposition rate	0.5 Å/s - 5 Å/s (material dependens)
Process parameter range	Process Temperature	Approximately room temperature
Process parameter range	Process pressure	Low than 4*10^-6 mbar
Substrates	Batch size	Up to 8" wafer Or several smaller pieces Deposition on one side of the substrate
	Substrate material allowed	Silicon wafers Quartz wafers Pyrex wafers
	Material allowed on the substrate	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals

* For thicknesses above 200 nm permission is requested.

Revision as of 16:19, 12 October 2017 view source Mdyma (talk \| contribs) danchip 584 edits →Alcatel - A system for deposition of metals ← Older edit		Revision as of 16:19, 12 October 2017 view source Mdyma (talk \| contribs) danchip 584 edits →Alcatel - A system for deposition of metals Newer edit →
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	==~~Alcatel~~ - A system for deposition of metals==		==Thermal evaporator- A system for deposition of metals==
	[[Image:IMG_2592_edit.jpg\|300x300px\|thumb\| positioned in cleanroom A-1.]]		[[Image:IMG_2592_edit.jpg\|300x300px\|thumb\| positioned in cleanroom A-1.]]