Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions
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Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing. 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!''' | Always use one of these cleaning procedures after KOH etch or hot phosphoric acid etch (Nitride etch) to remove alkali ions before further processing. 7-up and Piranha should only be used '''AFTER''' stripping resist by other means (see [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip Resist strip] page). Cleaning samples with resist coatings or significant amounts of other organic substances can be very dangerous, because 7-Up and Piranha are so aggressive. '''These solutions are intended for removing TRACES of organic matter. Adding large amounts of organics can lead to explosive reactions!''' | ||
[[Image: | [[Image:WaferClean.jpg|300x300px|right|thumb|'Wafer clean' bath in cleanroom D3]] | ||
[[Image: | [[Image:MaskClean.jpg|300x300px|right|thumb|'Mask clean' bath in cleanroom D3]] | ||
[[Image: | [[Image:FH01-02.jpg|300x300px|right|thumb|Fume hood 01 and 02 in cleanroom D3]] | ||
[[Image:Stinkskab_RR2.jpg|300x300px|right|thumb|Fume hood(RCA) in cleanroom B1]] | |||
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User manuals, risk assessments and contact information can be found on the equipment Info-pages in LabManager:<br> | User manuals, risk assessments and contact information can be found on the equipment Info-pages in LabManager:<br> | ||