Jump to content

Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

BGE (talk | contribs)
No edit summary
Jml (talk | contribs)
Line 9: Line 9:




===A rough overview of the performance Disco DAD321 Dicer===
===Overview of the performance Disco DAD321 Dicer===


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Equipment for dicing out samples.||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Equipment for dicing out samples
|style="background:WhiteSmoke; color:black"|
*Pure Silicon samples
*Pure Silicon samples
*Silicon bonded to Silicon
*Silicon bonded to Silicon
Line 20: Line 21:
*Pyrex/Borofloat
*Pyrex/Borofloat
|-
|-
!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
|style="background:LightGrey; color:black"|X-axis cutting range||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|X-axis cutting range
|style="background:WhiteSmoke; color:black"|
192 mm
192 mm
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|X-axis cut speed
|style="background:LightGrey; color:black"|X-axis cut speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.1 - 300 mm/sec
0.1 - 300 mm/sec
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Y-axis cutting range
|style="background:LightGrey; color:black"|Y-axis cutting range
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
162 µm
162 µm
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Y-axis index step
|style="background:LightGrey; color:black"|Y-axis index step
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.0002 mm
0.0002 mm
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Y-axis single error
|style="background:LightGrey; color:black"|Y-axis single error
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.003 or less
0.003 or less
Line 46: Line 48:
ø76.2 mm
ø76.2 mm
|-
|-
!style="background:silver; color:black" align="left"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
up to 6"
up to 6"
|-
|-
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Layers that can't be diced
| style="background:LightGrey; color:black"|Layers that can't be diced
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Thick metal (>0.75 mm)
*Thick metal (>0.75 mm)