Specific Process Knowledge/Characterization/Probe station: Difference between revisions
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'''The user manual, technical information and contact information can be found in LabManager:''' | '''The user manual, technical information and contact information can be found in LabManager:''' | ||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=343 Probe station]''' | '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=343 Probe station]''' |
Revision as of 12:04, 21 September 2017
Probe station
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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
Purpose |
Thickness measurer |
|
---|---|---|
Performance |
Thickness resolution |
|
Substrates |
Batch size |
|
Substrate materials allowed |
|
The user manual, technical information and contact information can be found in LabManager: