Specific Process Knowledge/Characterization/Probe station: Difference between revisions

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During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
==Quality Control - Recipe Parameters and Limits==
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
|-
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
|}


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==

Revision as of 13:03, 21 September 2017

Probe Station

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Thickness measurer

Probe station. Positioned in serviceroom CX1

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger mesas

Performance

Thickness resolution

  • < 5 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions


The Probe station is a - EPS150Triax - Cascade for I/V measurement, ohmic measurements etc, it has 4 individually adjustable probes, but can be fitted with more. It has several source meters, multi meters and a computer attached.

It can be used from pieces up to 6" wafers

File:Probestation.jpg
Probe station: positioned in Service room CX1

The user manual, technical information and contact information can be found in LabManager:

Probe station

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