Specific Process Knowledge/Characterization/Probe station: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Probe_Station click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Probe_Station click here]''' | ||
==Thickness measurer== | |||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | |||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | |||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | |||
'''The user manual, technical information and contact information can be found in LabManager:''' | |||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | |||
==Quality Control - Recipe Parameters and Limits== | |||
{| border="1" cellspacing="2" cellpadding="2" colspan="3" | |||
|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer''' | |||
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The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. | |||
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br> | |||
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br> | |||
|} | |||
==Equipment performance and process related parameters== | |||
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Purpose | |||
|style="background:LightGrey; color:black"| | |||
Thickness measurer | |||
|style="background:WhiteSmoke; color:black"| | |||
*Wafer thickness | |||
*Depths of larger grooves | |||
*Heigth of larger mesas | |||
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!style="background:silver; color:black" align="center"| | |||
Performance | |||
|style="background:LightGrey; color:black"| | |||
Thickness resolution | |||
|style="background:WhiteSmoke; color:black"| | |||
*< 5 µm | |||
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Substrates | |||
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Batch size | |||
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*One sample | |||
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| style="background:LightGrey; color:black"|Substrate materials allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*No restrictions | |||
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Revision as of 11:52, 21 September 2017
Probe Station
Feedback to this page: click here
Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
|
Purpose |
Thickness measurer |
|
|---|---|---|
|
Performance |
Thickness resolution |
|
|
Substrates |
Batch size |
|
| Substrate materials allowed |
|
The Probe station is a - EPS150Triax - Cascade for I/V measurement, ohmic measurements etc, it has 4 individually adjustable probes, but can be fitted with more. It has several source meters, multi meters and a computer attached.
It can be used from pieces up to 6" wafers
The user manual, technical information and contact information can be found in LabManager: