LabAdviser/Courses: Difference between revisions
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== | == Mask Design == | ||
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DTU Danchip offers a Tool Package Training in Mask Design. | DTU Danchip offers a Tool Package Training in Mask Design. | ||
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!Schedule | !Schedule | ||
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* Self-study using screen cast videoes demonstrating the use of either CleWin og L-edit. | |||
* Self-study using screen cast videoes demonstrating the use of either CleWin og L-edit | * An exercise where you are guided through the design of a mask. | ||
* An optional ½ hour Q&A session with an expert on mask layout. You can make an appointment after finishing the exercise. | * An optional ½ hour Q&A session with an expert on mask layout. You can make an appointment after finishing the exercise. | ||
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!Location | !Location | ||
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* Anywhere you like. DTU network access required. | |||
* Anywhere you like. | |||
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!Qualified Prerequisites | !Qualified Prerequisites | ||
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* | * Basic knowledge about micro-lithography | ||
* Access to a computer where you can install Clewin or L-edit | |||
** Danchip provide free access to Clewin 5 use through a network license. | |||
** If you want to use L-edit you will need a valid license of your own | |||
* Basic knowledge about micro-fabrication techniques | |||
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!Preparations | !Preparations | ||
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None | |||
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!Learning Objectives | !Learning Objectives | ||
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* Get acquainted with | * Get acquainted with either Clewin 5 or L-edit mask design programs | ||
* | * construct basic mask structures (rectangles, polygons, circles etc.) | ||
** | * Be able to manipulate shapes in different ways (merge, intersect, XOR, subtract, invert, move, scale, rotate, mirror, grow/shrink, duplicate, align etc.) | ||
** | * use mask layers for a process | ||
* organize a hierarchical mask design | |||
* choose mask polarity and orientation for different resist types and Front/Back-side alignment | |||
* discuss tolerances related to mask design/process flows | |||
* distinguish between critical/non-critical process/mask steps | |||
* design appropriate test structures for a process | |||
* select appropriate alignment marks for a process | |||
* make a chip/wafer layout usable for dicing | |||
* export the layout to cif or gds files with appropriate layer names | |||
* make a mask order | |||
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