Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions
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!'''Allowed materials''' | !'''Allowed materials''' | ||
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*All processed wafers have to be RCA cleaned, except wafers from LPCVD furnaces and | *All processed wafers have to be RCA cleaned, except wafers from LPCVD furnaces and PECVD4. | ||
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*All processed wafers have to be RCA cleaned, except wafers from the Wafer Bonder 02 and from PECVD4 and PECVD3. | *All processed wafers have to be RCA cleaned, except wafers from the Wafer Bonder 02 and from PECVD4 and PECVD3. | ||