Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions
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*All processed wafers have to be RCA cleaned, except wafers from LPCVD furnaces and PECVD2. | *All processed wafers have to be RCA cleaned, except wafers from LPCVD furnaces and PECVD2. | ||
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*All processed wafers have to be RCA cleaned, except wafers from | *All processed wafers have to be RCA cleaned, except wafers from the Wafer Bonder 02 and from PECVD4 and PECVD3. | ||
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*Wafers with Al | *Wafers with Al | ||