Specific Process Knowledge/Thin film deposition/Physimeca

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Physimeca

The Physicmeca, placed in the III-V laboratory, cleanroom A-5.

Physimeca is a system for deposition of metals through electron-beam evaporation, intended for III-V processing.

Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples of different sizes and shapes. It will also take samples of almost any shape as long as they can fit on the sample holders; there are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.

Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (thinfilm@danchip.dtu.dk) if you have wishes for other metals.

The user manual and contact information can be found in LabManager:

Physimeca in LabManager

Equipment performance and process related parameters Physimeca

Purpose	Deposition of metals	E-beam evaporation of metals
Performance	Film thickness	10 Å - 5000 Å*
	Available metals and deposition rates (Å/s)	Gold (Au) 10 Chromium (Cr) 5 Platinum (Pt) 5 Titanium (Ti) 5 Nickel (Ni) 5 Germanium (Ge) 5 Palladium (Pd) 5 Silver (Ag)
Process parameter range	Process Temperature	Less then 80 oC
	Process pressure	2x10-6 mbar
	Distance between e-beam and substrate	46 cm
Substrates	Batch size	2 or 4" wafers Or several smaller pieces
	Substrate material allowed	III-V materials Si
	Materials allowed on the substrate	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar

* For thicknesses above 2000 Å special permission is required (contact thinfilm@danchip.dtu.dk).