Specific Process Knowledge/Etch/Aluminum Oxide: Difference between revisions

@@ Line 3: / Line 3: @@
 =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-
+|-style="background:silver; color:black"
+!
+![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Method 1]]
+![[Specific Process Knowledge/Thin film deposition/PECVD|Method 2]]
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Generel description
+|Generel description - method 1
+|Generel description - method 2
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Parameter 1
+|
+*A
+*B
+|
+*A
+*B
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Parameter 2
+|
+*A
+*B
+*C
+|
+*A
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Substrate size
+|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers
+|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!'''Allowed materials'''
+|
+*Allowed material 1
+*Allowed material 2
+|
+*Allowed material 1
+*Allowed material 2
+*Allowed material 3
+|-
+|}
+<br clear="all" />
 *[[/Al2O3 Etch with ICP Metal|Al2O3 etch using ICP metal]]
 *[[/Al2O3 Etch with III-V ICP|Al2O3 etch using III-V ICP]]