Specific Process Knowledge/Etch/Aluminum Oxide: Difference between revisions
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! | |||
![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Method 1]] | |||
![[Specific Process Knowledge/Thin film deposition/PECVD|Method 2]] | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Generel description | |||
|Generel description - method 1 | |||
|Generel description - method 2 | |||
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|-style="background:LightGrey; color:black" | |||
!Parameter 1 | |||
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*A | |||
*B | |||
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*A | |||
*B | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Parameter 2 | |||
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*A | |||
*B | |||
*C | |||
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*A | |||
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|-style="background:LightGrey; color:black" | |||
!Substrate size | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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|-style="background:WhiteSmoke; color:black" | |||
!'''Allowed materials''' | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 | |||
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|} | |||
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*[[/Al2O3 Etch with ICP Metal|Al2O3 etch using ICP metal]] | *[[/Al2O3 Etch with ICP Metal|Al2O3 etch using ICP metal]] | ||
*[[/Al2O3 Etch with III-V ICP|Al2O3 etch using III-V ICP]] | *[[/Al2O3 Etch with III-V ICP|Al2O3 etch using III-V ICP]] |
Revision as of 10:26, 27 June 2017
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THIS PAGE IS UNDER CONSTRUCTION
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