Specific Process Knowledge/Characterization/Profiler: Difference between revisions
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==Dektak XTA stylus profiler== | ==Dektak XTA stylus profiler== | ||
The Dektak XTA stylus profiler from Brüker is usable for profiling surfaces of samples with structures in the micro- and nanometer range. | The Dektak XTA stylus profiler from Brüker is usable for profiling surfaces of samples with structures in the micro- and nanometer range. However, the size of the structures that can be measured is limited by the tip dimensions. | ||
A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. [[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] of thin films can be done by measuring the wafer bow. | A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. [[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] of thin films can be done by measuring the wafer bow. | ||
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==Dektak 8 stylus profiler== | ==Dektak 8 stylus profiler== | ||