Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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''NOTE: As a general rule, the lower the pressure and higher the power (i.e. higher the deposition rate), the better.'' | ''NOTE: As a general rule, the lower the pressure and higher the power (i.e. higher the deposition rate), the better.'' | ||
Film characteristics: | Film characteristics (5-10 wafers for each thickness): | ||
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! Thickness [nm] | ! Thickness [nm] | ||
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''NOTE: After depositing 10layers of 10nm each, the roughness increased to 0.8nm RMS'' | ''NOTE: After depositing 10layers of 10nm each, one on top of eachother, the roughness increased to 0.8nm RMS'' | ||
Work done by Johneph Sukham ([mailto:johsu@fotonik.dtu.dk?Subject=Thin%20Au%20deposition%20using%20Lesker click to email]) and Radu Malureanu ([mailto:rmal@dtu.dk?Subject=Thin%20Au%20deposition%20using%20Lesker click to email]) | Work done by Johneph Sukham ([mailto:johsu@fotonik.dtu.dk?Subject=Thin%20Au%20deposition%20using%20Lesker click to email]) and Radu Malureanu ([mailto:rmal@dtu.dk?Subject=Thin%20Au%20deposition%20using%20Lesker click to email]) | ||