Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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For depositing very thin, down to 6nm continuous Au layers on Si/SiO<sub>2</sub> substrates. Works also with ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> as substrate. | For depositing very thin, down to 6nm continuous Au layers on Si/SiO<sub>2</sub> substrates. Works also with ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> as substrate. | ||
Adhesion promoter: aminopropyltrimethoxysilane (APTMS). | Adhesion promoter: aminopropyltrimethoxysilane (APTMS). MSDS [[media:MSDS_APTMS.pdf|here]]. <br/> | ||
Adhesion promoter deposition: 3h immersion in 95%IPA, 2.5% H<sub>2</sub>O, 2.5% APTMS. | Adhesion promoter deposition: 3h immersion in 95%IPA, 2.5% H<sub>2</sub>O, 2.5% APTMS. | ||