Specific Process Knowledge/Bonding/Anodic bonding: Difference between revisions

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Anodic Bonding

Anodic bonding can only occur between a Silicon wafer and a Pyrex (Borofloat) glass, not a quartz (fused silica). It is a strong chemical bond made by an E-field depleting the surface of the Pyrex wafer from Na+ ions. Hence it is very important to stack the Si wafers and the Pyrex wafer in the right order. Otherwise the Pyrex wafer could bond to the chuck or electrode, depending on the direction of the E-Field. The Wafer Bonder 02 only operates with an negative voltage meaning that one should always place the Si wafer closest to the chuck, and the Pyrex wafer closest to the electrode. Almost no force is needed to push the wafers together normally 1000 mbar. For a normal bond the temperature used is 400°C and the voltage is 600V. It is possible to decrease the temperature if one increases the voltage, eg. T=320°C and V=1200V.

Try and put this as one of the last steps in you process sequence, since you cannot do high temperature steps in DANCHIPS cleanroom with Pyrex wafer. This also includes the plasma systems.

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 ==Anodic Bonding==
-Anodic bonding can only occur between a Silicon wafer and a Pyrex (Borofloat) glass, not a quartz (fused silica). It is a strong chemical bond made by an E-field depleting the surface of the Pyrex wafer from Na+ ions. Hence it is very important to stack the Si wafers and the Pyrex wafer in the right order. Otherwise the Pyrex wafer could bond to the chuck or electrode, depending on the direction of the E-Field. The EVG NIL only operates with an negative voltage meaning that one should always place the Si wafer closest to the chuck, and the Pyrex wafer closest to the electrode. Almost no force is needed to push the wafers together normally 1000N. For a normal bond the temperature used is 400°C and the voltage is 600V. It is possible to decrease the temperature if one increases the voltage, eg. T=320°C and V=1200V.
+Anodic bonding can only occur between a Silicon wafer and a Pyrex (Borofloat) glass, not a quartz (fused silica). It is a strong chemical bond made by an E-field depleting the surface of the Pyrex wafer from Na+ ions. Hence it is very important to stack the Si wafers and the Pyrex wafer in the right order. Otherwise the Pyrex wafer could bond to the chuck or electrode, depending on the direction of the E-Field. The Wafer Bonder 02 only operates with an negative voltage meaning that one should always place the Si wafer closest to the chuck, and the Pyrex wafer closest to the electrode. Almost no force is needed to push the wafers together normally 1000 mbar. For a normal bond the temperature used is 400°C and the voltage is 600V. It is possible to decrease the temperature if one increases the voltage, eg. T=320°C and V=1200V.
-Please be advised that it is notoriously difficult to use the EVG NIL bond aligner, due to its manual nature it is strongly advised to book extra time to do alignment. However alignment of +-2 microns is possible by very exprienced users. The alignment marks (on the masks) are to be positioned at y=0 and x=+-40mm for 4", for optimal result.
 Try and put this as one of the last steps in you process sequence, since you cannot do high temperature steps in DANCHIPS cleanroom with Pyrex wafer. This also includes the plasma systems.