Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
/* Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Danchip an 'RCA clean' prior to bonding (and doing cleaning and bonding very early in the morning with few people and thus lower particle level)... |
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| Line 80: | Line 80: | ||
Temp: 80<sup>o</sup>C<br> | Temp: 80<sup>o</sup>C<br> | ||
Time: 20 min<br> | Time: 20 min<br> | ||
|Re-use | |Re-use piranha previously made in step 2 | ||
Makes wafers hydrophilic | Makes wafers hydrophilic | ||