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Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, danchip
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DCH-Employees-701, NLAB-Employees-701, danchip
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*Takes 1½ hours
*Takes approximately 1,5 hours
*Orient flat to minimize handling
*Orient flat to minimize handling
*Preferable done just before bonding!
*Preferable do the cleaning just before bonding!
|Get CLEAN box for wafers!!!
|Get CLEAN box for wafers!!!
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|Piranha
|Piranha
|Mixture: H<sub>2</sub>SO<sub>4</sub>:H<sub>2</sub>O<sub>2</sub> (4:1)
|Mixture: H<sub>2</sub>SO<sub>4</sub>:H<sub>2</sub>O<sub>2</sub> (4:1)
Temp: 80 <sup>o</sup>C
Temp: 80<sup>o</sup>C
Time: 5 min
Time: 5 min
(a yellow and a black spot)
(a yellow and a black spot)
|Clean tank (cleanroom B1, 7-up bath for wafers) and make your own or make in dedicated glass.
|You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). <b>However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes!</b>. Alternatively use a very clean glass beaker.
Pour up H<sub>2</sub>SO<sub>4</sub> first, put wafers in carrier (USE this in steps 2-7), add H<sub>2</sub>O<sub>2</sub>, wait 30 sec, dip wafers.
Pour up H<sub>2</sub>SO<sub>4</sub> first, put wafers in carrier (USE this in steps 2-7), add H<sub>2</sub>O<sub>2</sub>, wait 30 sec, dip wafers.
|Maybe clean the tank the day before!
|Maybe clean the tank the day before!
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