Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions

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+===The IMEC process is used for cleaning of wafers prior to fusion bonding===
+The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' Has been slightly modified by Karen Birkelund.
 '''The user manual, user APV and contact information can be found in LabManager:'''
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-===The IMEC process is used for cleaning of wafers prior to fusion bonding:===
-This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' <br \>
-Has been slightly modified by Karen Birkelund.
 {| border="1" cellspacing="0" cellpadding="5" align="center"