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*[http://podcast.llab.dtu.dk/feeds/dtu-danchip/?tx_enotepodcast_pi1%5BshowDetails%5D=b4deb2d0030f3141f41a4497375bf861&cHash=a75fab158fec382198b74336cba7bdc4 Run a Process]
*[http://podcast.llab.dtu.dk/feeds/dtu-danchip/?tx_enotepodcast_pi1%5BshowDetails%5D=b4deb2d0030f3141f41a4497375bf861&cHash=a75fab158fec382198b74336cba7bdc4 Run a Process]
*[http://podcast.llab.dtu.dk/feeds/dtu-danchip/?tx_enotepodcast_pi1%5BshowDetails%5D=b995b7088690f218f73c24a6bd6361ad&cHash=c6076806edcff2f12036b4e41cbee14d Removing a Wafer from the Load Lock]
*[http://podcast.llab.dtu.dk/feeds/dtu-danchip/?tx_enotepodcast_pi1%5BshowDetails%5D=b995b7088690f218f73c24a6bd6361ad&cHash=c6076806edcff2f12036b4e41cbee14d Removing a Wafer from the Load Lock]
*[http://podcast.llab.dtu.dk/feeds/dtu-danchip/?tx_enotepodcast_pi1%5BshowDetails%5D=742052c10f9e77778ffab73561b9e840&cHash=44832011bb363b1162900338c834c785 The Process Log]]
*[http://podcast.llab.dtu.dk/feeds/dtu-danchip/?tx_enotepodcast_pi1%5BshowDetails%5D=742052c10f9e77778ffab73561b9e840&cHash=44832011bb363b1162900338c834c785 The Process Log]





Revision as of 12:18, 28 March 2017

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Courses

We are building up a number of courses to educate our users in using the cleanroom facility and the equipment inside. Below you can see the courses that are presently running. The "Cleanroom introduction Course" is mandatory for all users that need to enter the cleanroom facility on their own. Then there is a number of TPT's (Tool Package Training Courses) that you need to attend depending on which kind of tool you need to use inside the facility.

The Cleanroom Introduction Course

For information regarding the Introduction Course, please take a look at the DTU Danchip homepage, a direct link is given here: [1]

The Lithography TPT

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.


Lithography Tool Package Training
Schedule

Theoretical part

  • The lecture has been replaced by videos that can be viewed at one's leisure.
  • A 1 hour "questions and exercises" session once or twice a month will be planned as needed (typically Fridays 09:30-10:30).
  • NEXT "questions and exercises" sessions: 31st of March, 21st of April, 28th of April, 19th of May

Practical part

  • A 4-5 hour training session 2-3 times a month, max. 4 persons per session (typically Wednesdays 09:00 - 14:00).
  • NEXT training sessions: 5th of April, 26th of April, 3rd of May, 24th of May
Location

Theoretical part

  • The location of the "questions and exercises" session will be specified after signing up for the course.

Practical part

  • The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
Qualified Prerequisites
  • Cleanroom safety course at DTU Danchip
  • Admission to the cleanroom must be obtained before the training session
Preparations

Before the "questions and exercises" session

  • Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus)
  • Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos.

Before training session

  • Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
  • Study the equipment manuals. The manuals are available in LabManager.
  • Study the TPT process flows (first print, and alignment).

Links to literature, lecture videos, training videos, equipment manuals, and process flows can be found in the section below.

Course Responsible

The Lithography Group at DTU Danchip.

Sign up for the course by e-mailing to lithography@danchip.dtu.dk.

Learning Objectives
  • Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
  • Authorization to use spin coater, mask aligner, and developer at DTU Danchip
  • Calculate relevant process parameters
  • Analyze and apply your results of lithographic processing


Material for preparations and further information

Literature


Lecture videos


Slides from Lecture

Training videos


Manuals


Process Flows


The Dry Etch TPT

DTU Danchip offers a Tool Package Training in Dry etching; the course includes theory on dry etching and equipment, as well as training in equipment operation in the cleanroom.

The course is for all users that intend to perform any kind of plasma dry etching in the cleanroom, and is a prerequisite for training in any of the plasma dry etch equipment's.


Dry Etch Tool Package Training
Schedule

Theoretical part

  • The next 3 hour lecture is on the 28th of Marts from 9:00 to approximately 12.

Practical part

  • A 2-3 hour training session, max. 3 persons per session will be planed after the lecture
Location

Theoretical part

  • The location of the lecture will be notified after you have signed up

Practical part

  • The training session takes place inside the cleanroom. The meeting point will be in The gauning area
Qualified Prerequisites
  • Cleanroom safety course at DTU Danchip
  • Admission to the cleanroom must be obtained before the training session
Preparations

Before the lecture

Before training session

  • Watch the training video: of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
  • Watch the screen cast video's for the ASE/AOE software:See below
  • Watch the screen cast video's for the DRIE/ICP meat and III-V ICP: See below
Course Responsible

The Dry Etch Group at DTU Danchip.

Sign up for the course by e-mailing to dryetch@danchip.dtu.dk.

Learning Objectives
  • Know why and when to use dry etching
  • Use the dry etchers without harming the machines
  • Select the right instrument to use for his/her dry etch processing
  • Select an appropriate etch recipe for his/her dry etch processing
  • Spot when the recipe needs to be tuned for his/her needs and
  • Suggest relevant tuning parameters


Material for preparations and further information

Literature


Pre Lecture video


Slides from Lecture

Pre hands-on training videos
Screen cast videos for the DRIE, ICP metal and III-V ICP:

Screen cast videos for the ASE and AOE:


Manuals


Process Flows


The SEM TPT