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==PhotoLuminescense Mapper RPM2000 ==
==PhotoLuminescense Mapper RPM2000 ==
[[Image:PL-mapper.jpg|500px|right|thumb|Positioned in the MOCVD room: F-1]]


Photoluminiscense mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscense Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.
Photoluminiscense mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscense Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.


It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range.
[[Image:Wafer-bonding PL-mapper (LabAdviser) Jehem.jpg|500px|right|thumb|Wafer-bonding PL-mapper (LabAdviser) Jehem.jpg]]
 
It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).


'''The user manual and contact information can be found in LabManager:'''
'''The user manual and contact information can be found in LabManager:'''


[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper]
[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper]
[[Image:PL-mapper.jpg|500px|right|thumb|Positioned in the MOCVD room: F-1]]


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