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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.


'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''  
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''  
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