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<!--* NEXT "questions and exercises" sessions: '''24th of March, 31st of March, 21st of April, 28th of April, 19th of May'''-->
<!--* NEXT "questions and exercises" sessions: '''24th of March, 31st of March, 21st of April, 28th of April, 19th of May'''-->
'''Practical part'''
'''Practical part'''
* A 4-5 hour training session once a week, max. 4 persons per session (typically Wednesdays 09:00 - 14:00).  
* A 4-5 hour training session twice a month, max. 4 persons per session (typically Wednesdays 09:00 - 14:00).  
<!--* NEXT training sessions: '''29th of March, 5th of April, 26th of April, 3rd of May, 24th of May'''-->
<!--* NEXT training sessions: '''29th of March, 5th of April, 26th of April, 3rd of May, 24th of May'''-->
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Revision as of 09:41, 22 March 2017


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Comparing lithography methods at DTU Danchip

UV Lithography DUV Stepper Lithography E-beam Lithography Nano Imprint Lithography
Generel description Pattern transfer via UltraViolet (UV) light Pattern transfer via DeepUltraViolet (DUV) light Patterning by electron beam Pattern transfer via hot embossing (HE)
Pattern size range
  • Resist type, thickness, and pattern dependent
  • ~1.25 µm and up
  • pattern type, shape and pitch dependent
  • ~200 nm and up
  • ~12 nm - 1 µm
  • ~20 nm and up
Resist type
  • UV sensitive:
    • AZ 5214E, AZ 4562, AZ MiR 701 (positive)
    • AZ 5214E, AZ nLOF 2020, SU-8 (negative)
  • DUV sensitive
    • JSR KRF M230Y, JSR KRF M35G (positive)
    • UVN2300-0.8 (negative)
  • E-beam sensitive
    • AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
  • Imprint polymers:
    • Topas
    • PMMA
Resist thickness range

~0.5µm to 20µm

~50nm to 2µm

~30nm to 0.5 µm

~ 100nm to 2µm

Typical exposure time

2s-30s pr. wafer

Process depended, depends on pattern, pattern area and dose

Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I

Process depended, depends also on heating and cooling temperature rates

Substrate size
  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers

We have cassettes that fit to

  • 4 small samples (20mm, 12mm, 8mm, 4mm)
  • 6 wafers of 50 mm in size
  • 3 wafers of 100 mm in size
  • 1 wafer of 150 mm in size

Only one cassette can be loaded at time

  • small samples
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials
  • Any standard cleanroom material
  • Any standard cleanroom material
  • Any standard cleanroom material
  • Any standard cleanroom material


Equipment Pages

Pretreatment

Coaters

Baking

UV Exposure

Deep-UV Exposure

Electron Beam Exposure

Development

Strip

Lift-off

NanoImprint Lithography


Lithography Tool Package Training

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.


For details, dates, and course material, please check the course description under Courses.


Lithography Tool Package Training
Schedule

Theoretical part

  • A 1 hour "questions and exercises" session once or twice a month will be planned as needed (typically Fridays 09:30-10:30).

Practical part

  • A 4-5 hour training session twice a month, max. 4 persons per session (typically Wednesdays 09:00 - 14:00).
Location

Theoretical part

  • The location of the "questions and exercises" session will be specified after signing up for the course.

Practical part

  • The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
Qualified Prerequisites
  • Cleanroom safety course at DTU Danchip
  • Admission to the cleanroom must be obtained before the training session
Preparations

Before the "questions and exercises" session

  • Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus)
  • Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos.

Before training session

  • Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
  • Study the equipment manuals. The manuals are available in LabManager.
  • Study the TPT process flows (first print, and alignment).
Course Responsible

The Lithography Group at DTU Danchip.

Sign up for the course by e-mailing to lithography@danchip.dtu.dk.

Learning Objectives
  • Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
  • Authorization to use spin coater, mask aligner, and developer at DTU Danchip
  • Calculate relevant process parameters
  • Analyze and apply your results of lithographic processing



Knowledge and Information about Lithography

Literature


Lecture videos


Slides from Lecture

Training videos


Manuals


Process Flows

Resists


UV Exposure


Electron Beam Exposure


Deep-UV Exposure


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