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LabAdviser/Technology Research/Fabrication of Hyperbolic Metamaterials using Atomic Layer Deposition/AZO pillars: Difference between revisions

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Eves (talk | contribs)
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!1.6
|Plasma surface treatment.
|Plasma surface treatment.
|To ensure that remainings of DUV resist are gone, samples are treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step)
|To ensure that remainings of DUV resist are gone, samples are treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step)
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|Scanning Electron Microscopy inspection.  
|Scanning Electron Microscopy inspection.  
|By cleaving the sample it is possible to inspect DRIE etched Si trenches in cross-sectional mode.
|By cleaving the sample it is possible to inspect DRIE etched Si holes in cross-sectional mode.
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]]  
[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]]  
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
|[[image:Si_trench007.jpg|250x350px|center]]
|See Figures 3a and 4a above.
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!1.8
|Atomic Layer Deposition of Al-doped ZnO (AZO).
|Atomic Layer Deposition of Al-doped ZnO (AZO).
|Deposition carried at 200<sup>o</sup>C. Thickness is above 100 nm.
|Deposition carried at 250<sup>o</sup>C. For compleate pillars the thickness needs to above 100 nm. For AZO tubes only 20 nm (partial deposition) requires.
||Equipment used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200|ALD Picosun R200]]. Standard recipe used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD| AZO 20T]].
||Equipment used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200|ALD Picosun R200]]. Standard recipe used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD| AZO 25T]].
|[[image:02_ALD_eves.jpg|250x350px|center]]
|[[image:6_3_ALD_full pillars.jpg|250x350px|center]]
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|Scanning Electron Microscopy inspection.
|Scanning Electron Microscopy inspection.
|By cleaving the sample it is possible to inspect ALD coatings deposited on Si trenches in cross-sectional mode.
|By cleaving the sample it is possible to inspect ALD coatings deposited on Si trenches in cross-sectional mode.
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
|[[image:03_ALD_eves_AZO.jpg|250x350px|center]]
|See figures 3b and 4b above.
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|- style="background:#BCD4E6; color:black"
|- style="background:#BCD4E6; color:black"
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|Ion Beam Etching (IBE).
|Ion Beam Etching (IBE).
|Opening of deposited AZO top layer using recipe [[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Ti_etch|"Ti acceptance"]] there the stage was placed to 0<sup>o</sup> degree. The back side of the wafer also needs to be exposed to etching.
|Opening of deposited AZO top layer using recipe [[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Ti_etch|"Ti acceptance"]] there the stage was placed to 0<sup>o</sup> degree. The back side of the wafer also needs to be exposed to etching.
|[[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300|IBE/IBSD Ionfab 300]]
|[[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300|IBE/IBSD Ionfab 300]]
|[[image:04_ALD_eves.jpg|250x350px|center]]
|[[image:7_ALD_fill pillars_Ar.jpg|250x350px|center]]
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!1.900000000000000000000000000000
!1.11
|Scanning Electron Microscopy inspection.
|Scanning Electron Microscopy inspection.
|By cleaving the sample it is possible to inspect IBE etching results in cross-sectional mode.
|By cleaving the sample it is possible to inspect IBE etching results in cross-sectional mode.
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
|[[image:05_ALD_eves_ICP.jpg|250x350px|center]]
|See Figures 3c and 4c above.
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|- style="background:#BCD4E6; color:black"
|- style="background:#BCD4E6; color:black"
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|Selective etch of Si between ALD AZO coatings.
|Selective etch of Si between ALD AZO coatings.
|Si etching proceeds using reactive ion etching with isotropic process based on SF<sub>6</sub> process gas.
|Si etching proceeds using reactive ion etching with isotropic process based on SF<sub>6</sub> process gas.
||Equipment used: [[Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch)|RIE2]].
||Equipment used: [[Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch)|RIE2]].
|[[image:06_ALD_eves.jpg|250x350px|center]]
|[[image:8_final pillars.jpg|250x350px|center]]
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|Scanning Electron Microscopy inspection of fabricated structure.
|Scanning Electron Microscopy inspection of fabricated structures.
|Proof of final result.
|Proof of final result.
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
|[[image:07_ALD_eves_RIE_SF6.jpg|250x350px|center]]
|See Figures 2, 3d and 4d above.  
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