LabAdviser/Technology Research/Fabrication of Hyperbolic Metamaterials using Atomic Layer Deposition/AZO pillars: Difference between revisions
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!1. | !1.6 | ||
|Plasma surface treatment. | |Plasma surface treatment. | ||
|To ensure that remainings of DUV resist are gone, samples are treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step) | |To ensure that remainings of DUV resist are gone, samples are treated by O<sub>2</sub>/N<sub>2</sub> plasma. (Optional step) | ||
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!1. | !1.7 | ||
|Scanning Electron Microscopy inspection. | |Scanning Electron Microscopy inspection. | ||
|By cleaving the sample it is possible to inspect DRIE etched Si | |By cleaving the sample it is possible to inspect DRIE etched Si holes in cross-sectional mode. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | ||
| | |See Figures 3a and 4a above. | ||
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|- style="background:#BCD4E6; color:black" | |- style="background:#BCD4E6; color:black" | ||
!1. | !1.8 | ||
|Atomic Layer Deposition of Al-doped ZnO (AZO). | |Atomic Layer Deposition of Al-doped ZnO (AZO). | ||
|Deposition carried at | |Deposition carried at 250<sup>o</sup>C. For compleate pillars the thickness needs to above 100 nm. For AZO tubes only 20 nm (partial deposition) requires. | ||
||Equipment used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200|ALD Picosun R200]]. Standard recipe used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD| AZO | ||Equipment used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200|ALD Picosun R200]]. Standard recipe used: [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD| AZO 25T]]. | ||
|[[image: | |[[image:6_3_ALD_full pillars.jpg|250x350px|center]] | ||
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!1. | !1.9 | ||
|Scanning Electron Microscopy inspection. | |Scanning Electron Microscopy inspection. | ||
|By cleaving the sample it is possible to inspect ALD coatings deposited on Si trenches in cross-sectional mode. | |By cleaving the sample it is possible to inspect ALD coatings deposited on Si trenches in cross-sectional mode. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | ||
| | |See figures 3b and 4b above. | ||
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|- style="background:#BCD4E6; color:black" | |- style="background:#BCD4E6; color:black" | ||
!1. | !1.10 | ||
|Ion Beam Etching (IBE). | |Ion Beam Etching (IBE). | ||
|Opening of deposited AZO top layer using recipe [[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Ti_etch|"Ti acceptance"]] there the stage was placed to 0<sup>o</sup> degree. The back side of the wafer also needs to be exposed to etching. | |Opening of deposited AZO top layer using recipe [[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300/IBE_Ti_etch|"Ti acceptance"]] there the stage was placed to 0<sup>o</sup> degree. The back side of the wafer also needs to be exposed to etching. | ||
|[[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300|IBE/IBSD Ionfab 300]] | |[[Specific_Process_Knowledge/Etch/IBE⁄IBSD_Ionfab_300|IBE/IBSD Ionfab 300]] | ||
|[[image: | |[[image:7_ALD_fill pillars_Ar.jpg|250x350px|center]] | ||
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!1. | !1.11 | ||
|Scanning Electron Microscopy inspection. | |Scanning Electron Microscopy inspection. | ||
|By cleaving the sample it is possible to inspect IBE etching results in cross-sectional mode. | |By cleaving the sample it is possible to inspect IBE etching results in cross-sectional mode. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | ||
| | |See Figures 3c and 4c above. | ||
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|- style="background:#BCD4E6; color:black" | |- style="background:#BCD4E6; color:black" | ||
!1. | !1.12 | ||
|Selective etch of Si between ALD AZO coatings. | |Selective etch of Si between ALD AZO coatings. | ||
|Si etching proceeds using reactive ion etching with isotropic process based on SF<sub>6</sub> process gas. | |Si etching proceeds using reactive ion etching with isotropic process based on SF<sub>6</sub> process gas. | ||
||Equipment used: [[Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch)|RIE2]]. | ||Equipment used: [[Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch)|RIE2]]. | ||
|[[image: | |[[image:8_final pillars.jpg|250x350px|center]] | ||
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!1. | !1.13 | ||
|Scanning Electron Microscopy inspection of fabricated | |Scanning Electron Microscopy inspection of fabricated structures. | ||
|Proof of final result. | |Proof of final result. | ||
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[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | [[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] | ||
| | |See Figures 2, 3d and 4d above. | ||
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