Specific Process Knowledge/Characterization: Difference between revisions
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*[[/SEM: Scanning Electron Microscopy/FEI|FEI SEM]] | *[[/SEM: Scanning Electron Microscopy/FEI|FEI SEM]] | ||
*[[/SEM: Scanning Electron Microscopy/ | *[[/SEM: Scanning Electron Microscopy/Leo|LEO SEM]] | ||
*[[/SEM: Scanning Electron Microscopy/ | *[[/SEM: Scanning Electron Microscopy/Jeol|JEOL SEM]] | ||
===[[/AFM: Atomic Force Microscopy|AFM: Atomic Force Microscopy]] - ''writer: Berit - reviewer: Flemming''=== | ===[[/AFM: Atomic Force Microscopy|AFM: Atomic Force Microscopy]] - ''writer: Berit - reviewer: Flemming''=== | ||
Revision as of 09:49, 8 April 2008
Choose topic
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement - writer: Yvonne
- Element analysis
- Hydrophobicity measurement - writer: Jonas
- Resistivity measurement - writer: Jan
- Other electrical measurements - writer: Jan