Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions
Created page with " 300x300px|thumb|EVG NIL: positioned in D-4 The EVG NIL is a system for imprinting in polymers (Hot embossing), and for bonding on wafer scale. 3 differe..." |
No edit summary |
||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Wafer_Bonder_02 click here]''' | |||
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]= | |||
[[Image:EVG NIL.jpg|300x300px|thumb|EVG NIL: positioned in D-4]] | [[Image:EVG NIL.jpg|300x300px|thumb|EVG NIL: positioned in D-4]] | ||
The EVG NIL is a system for imprinting in polymers (Hot embossing), and for bonding on wafer scale. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult. | The EVG NIL is a system for imprinting in polymers (Hot embossing), and for bonding on wafer scale. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult. | ||
