Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions

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Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Physimeca)
General description	E-beam deposition of Pd	E-beam deposition of Pd
Pre-clean		RF Ar clean
Layer thickness	10Å to 3000Å*	10Å to 2000Å
Deposition rate	2Å/s to 10Å/s	2Å/s to 10Å/s
Batch size	Up to 1x4" wafers smaller pieces	1x 2" wafer or 1x 4" wafers or Several smaller pieces
Allowed materials	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar
Comment

* For thicknesses above 200 nm permission is requested.

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	Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.		Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.