Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions
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==Etching of Gold== | ==Etching of Gold== | ||
[[Image:Stinkskab RR2.jpg |300x300px|thumb|Wet Gold Etch can be done in | [[Image:Stinkskab RR2.jpg |300x300px|thumb|Wet Gold Etch can be done in Fumehood(RCA) in cleanroom B-1 or Fumehood 1 or 2 in cleanroom D-3]] | ||
Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV [http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here]. | |||
We have two different solutions: | We have two different solutions: | ||
# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask. | # Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask. | ||
# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and are therefore used when you wish to remove all the gold from your wafer. ''' | # Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrous oxide gases which are very toxic!!''' | ||