Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
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[[Category: Etch (Wet) bath|KOH etch]] | [[Category: Etch (Wet) bath|KOH etch]] | ||
== | ==Si etch - ''Anisotropic silicon etch''== | ||
KOH belongs to the family of anisotropic Si-etchants based on aqueous alkaline solutions. The anisotropy stems from the different etch rates in different crystal directions. The {111}-planes are almost inert whereas the etch rates of e.g. {100}- and {110}-planes are several orders of magnitude faster. | KOH belongs to the family of anisotropic Si-etchants based on aqueous alkaline solutions. The anisotropy stems from the different etch rates in different crystal directions. The {111}-planes are almost inert whereas the etch rates of e.g. {100}- and {110}-planes are several orders of magnitude faster. | ||