Jump to content

Specific Process Knowledge/Lithography/Strip: Difference between revisions

Rkch (talk | contribs)
Rkch (talk | contribs)
Line 260: Line 260:


[[Image:Lift-off wet bench.JPG|300x300px|thumb|Acetone strip bench in D-3]]
[[Image:Lift-off wet bench.JPG|300x300px|thumb|Acetone strip bench in D-3]]
{| border="1" cellspacing="0" cellpadding="4" align="left"
|[[Image:Acetone_rough.jpg|150x150px|thumb|Acetone bath "rough" for removing most of the resist]]
|[[Image:Acetone_fine.jpg|150x150px|thumb|Acetone bath "fine" for removing the rest of the resist incl. ultrasound]]
|-
|}


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Rough_and_Fine_Strip click here]'''
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Rough_and_Fine_Strip click here]'''


This acetone strip is only for wafers without metal and SU-8.
This resist strip is only for wafers without metal and SU-8.
 
There are two acetone bath: one rough for stripping the most of the resist from the surface and one fine with a ultrasound for cleaning the  resists remains.


There are one Remover 1165 bath stripping and one IPA bath for rinsing.


'''Here are the main rules for acetone strip use:'''
'''Here are the main rules for resist strip use:'''
*Place the wafers in a wafer holder and put them in the first bath for 2-5 min, this time is depending how much resist you have on the surface.  
*Place the wafers in a wafer holder and put them in the first bath for 10 min, this time is depending how much resist you have on the surface.  
*After the rough strip place your wafers directly in the final bath, switch on for the ultra sound  and strip them for 2-3 min.
*After the strip rinse your wafers in the IPA bath for 2-3 min.
*Rinse your wafers for 4-5 min. in running water after stripping .
*Rinse your wafers for 4-5 min. in running water after stripping.




Line 284: Line 277:
<br clear="all" />
<br clear="all" />


==Overview of acetone benches==
==Overview of wet bench 06==


{| border="2" cellspacing="0" cellpadding="4" align="left"
{| border="2" cellspacing="0" cellpadding="4" align="left"
!  
!  
! Acetone strip  
! Resist strip  
! Lift-off  
! Lift-off  
|-  
|-  
Line 298: Line 291:
|-
|-
|'''Chemical solution'''
|'''Chemical solution'''
|CH<sub>3</sub>COCH<sub>3</sub>
|NMP Remover 1165
|CH<sub>3</sub>COCH<sub>3</sub>
|NMP Remover 1165
|-
|-
|'''Process temperature'''
|'''Process temperature'''
|20 <sup>o</sup>C
|Up to 60 <sup>o</sup>C


|20 <sup>o</sup>C
|Up to 60 <sup>o</sup>C


|-
|-
Line 317: Line 310:
|
|
4" wafers
4" wafers
6" wafers
|
|
4" wafers
4" wafers
6" wafers
|-
|-
|'''Allowed materials'''
|'''Allowed materials'''