Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
Appearance
| Line 16: | Line 16: | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ||
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater# | ! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#Sputter coater 03|(Sputter coater 03)]] | ||
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#Sputter coater 04|(Sputter coater 04)]] | |||
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater# | |||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
| Line 26: | Line 25: | ||
| Sputter deposition of Au | | Sputter deposition of Au | ||
| E-beam deposition of Au | | E-beam deposition of Au | ||
| Sputter deposition of Au | | Sputter deposition of Au | ||
| Sputter deposition of Au | | Sputter deposition of Au | ||
| Line 35: | Line 33: | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| | | | ||
| Line 48: | Line 45: | ||
| | | | ||
| | | | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
| Line 58: | Line 55: | ||
|Not measured | |Not measured | ||
|Not measured | |Not measured | ||
|- | |- | ||
| Line 79: | Line 76: | ||
*Several smaller pieces | *Several smaller pieces | ||
| | | | ||
*Several smaller samples | |||
*1x4" wafer | *1x4" wafer | ||
| | | | ||
*Several smaller samples | *Several smaller samples | ||
*1x4" wafer | *1x4" wafer | ||
|- | |- | ||
| Line 125: | Line 120: | ||
* Pyrex wafers | * Pyrex wafers | ||
| | | | ||
* All samples allowed in the SEM Supra 1 | |||
| | | | ||
* All samples allowed in the SEM Supra 2 or 3 | |||
* All samples allowed in the SEM Supra | |||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
| Line 143: | Line 135: | ||
| | | | ||
|Used for gold sputter coating of | | | ||
samples before SEM inspection | * Used for gold sputter coating of samples before SEM inspection | ||
| | | | ||
* Used for gold sputter coating of samples before SEM inspection | |||
samples before SEM inspection | |||
|- | |- | ||
|} | |} | ||