Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions
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=ALD | =ALD 2 (PEALD)= | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/ALD_Picosun_R200 click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/ALD_Picosun_R200 click here]''' | ||
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[[Category: Thin Film Deposition|ALD]] | [[Category: Thin Film Deposition|ALD]] | ||
== ALD | == Thermal ALD and PEALD == | ||
[[image:ALD2.jpg|300x300px|right|thumb| | [[image:ALD2.jpg|300x300px|right|thumb|ALD 2 (PEALD), positioned in cleanroom F-2.]] | ||
The ALD 2 (PEALD) is used to deposit very thin and uniform layers of different materials, by use of thermal ALD or PEALD (Plasma Enhanced Atomic Layer Deposition). | The ALD 2 (PEALD) is used to deposit very thin and uniform layers of different materials, by use of thermal ALD or PEALD (Plasma Enhanced Atomic Layer Deposition). | ||
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The ALD is controlled by use of a computer with a touch screen that is situated next to the machine. | The ALD is controlled by use of a computer with a touch screen that is situated next to the machine. | ||
The ALD 2 (PEALD) is a Picosun R-200 Advanced Plasma ALD manufactured by Picosun, and it was installed in the cleanroom in 2016. The model is called | |||