Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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![[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] | ![[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] | ||
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | ![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]] | ||
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | ![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]] | ||
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!General description | !General description | ||
| The device is typical made in a thick film (10-100µm thick) of a polymer (SU-8) that is spun on a carrier (silicon wafer). This film is exposed through a mask and then developed and possible cured to make the polymer harder. | | The device is typical made in a thick film (10-100µm thick) of a polymer (SU-8) that is spun on a carrier (silicon wafer). This film is exposed through a mask and then developed and possible cured to make the polymer harder. | ||
| The device is typical made in a thick film (1-10µm thick) of a polymer that is spun on a carrier (silicon wafer). A master with the desired pattern is pressed into this film and the film is hardened by heating or UV-exposure. A residual layer has to be etched away by dry etching. It is possible to form very small 2½D structures over large areas relative fast. | | The device is typical made in a thick film (1-10µm thick) of a polymer that is spun on a carrier (silicon wafer). A master with the desired pattern is pressed into this film and the film is hardened by heating or UV-exposure. A residual layer has to be etched away by dry etching. It is possible to form very small 2½D structures over large areas relative fast. | ||
| The device is typically made in Topas, PP, PE, PS or a similar polymer. A master disk, called a shim, is usually fabricated in nickel or special aluminium alloys with the desired structures to be replicated. It is mounted in the tool of the injection moulding machine. Together they form a cavity into which molten polymer is injected. It is possible to replicate both small and large 2½D structures relatively fast. Many plastic items are made by injection molding, from toothbrushes and car bumpers to LEGO building blocks. | | The device is typically made in Topas, PP, PE, PS or a similar polymer. A master disk, called a shim, is usually fabricated in nickel or special aluminium alloys with the desired structures to be replicated. It is mounted in the tool of the injection moulding machine. Together they form a cavity into which molten polymer is injected. It is possible to replicate both small and large 2½D structures relatively fast. Many plastic items are made by injection molding, from toothbrushes and car bumpers to LEGO building blocks. | ||
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!Typical used for | !Typical used for | ||
|Optical waveguides, fluidic systems (master for PDMS/soft lithography) | |Optical waveguides, fluidic systems (master for PDMS/soft lithography) | ||
|?? | |?? | ||
|Fluidic devices, optical waveguides, surface modification. | |Fluidic devices, optical waveguides, surface modification. | ||
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!Processable materials | !Processable materials | ||
| | | | ||
*SU8 | *SU8 | ||
*AZ resists | *AZ resists | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Prerequisites | !Prerequisites | ||
|Sample with resist.<br> A glass mask with desired pattern. For mask layout software see [[Specific Process Knowledge/Lithography/UVLithography/Mask Design| Mask design]] | |Sample with resist.<br> A glass mask with desired pattern. For mask layout software see [[Specific Process Knowledge/Lithography/UVLithography/Mask Design| Mask design]] | ||
|Sample with polymer.<br> A stamp with the wanted pattern, usually in Si or SiO\rm{_2} however other materials could also be used. | |Sample with polymer.<br> A stamp with the wanted pattern, usually in Si or SiO\rm{_2} however other materials could also be used. | ||
|A stamp/shim with the wanted pattern, usually in Ni or Al, cut out to fit in the injection moulding machine. | |A stamp/shim with the wanted pattern, usually in Ni or Al, cut out to fit in the injection moulding machine. | ||
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!Throughput (when mask/stamp/pattern available) | !Throughput (when mask/stamp/pattern available) | ||
|medium: 5-10 wafers/hour depending on exposure time | |medium: 5-10 wafers/hour depending on exposure time | ||
|medium: 5-10 wafers/hour depending on imprint time | |medium: 5-10 wafers/hour depending on imprint time | ||
|fast: 10-200/hour | |fast: 10-200/hour | ||
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!Min/max featuresize | !Min/max featuresize | ||
|1µm - wafer size | |1µm - wafer size | ||
|100nm - µm | |100nm - µm | ||
|nm - mm | |nm - mm | ||
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!Post-treatment | !Post-treatment | ||
|resist developing/baking | |resist developing/baking | ||
|Dry Etch back (RIE), ?? Nano Imprint Lithography | |Dry Etch back (RIE), ?? Nano Imprint Lithography | ||
|Sprue/runner has to be broken or cut off. | |Sprue/runner has to be broken or cut off. | ||
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!Patterning degree of freedom | !Patterning degree of freedom | ||
|2D | |2D | ||
|2D. different depths possible | |2D. different depths possible | ||
|2D. Different depths possible. | |2D. Different depths possible. | ||
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*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
| | | | ||
*small samples | *small samples | ||
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!Allowed materials | !Allowed materials | ||
|Depending on tool used | |Depending on tool used | ||
|Nano Imprint Lithography | |Nano Imprint Lithography | ||
|Nickel, aluminium, steel, FDTS | |Nickel, aluminium, steel, FDTS | ||