Specific Process Knowledge/Etch/RIE (Reactive Ion Etch): Difference between revisions

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	In RIE2 it is allowed to have small amounts of metals exposed to the plasma.		In RIE2 it is allowed to have small amounts of metals exposed to the plasma.


	'''The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:'''		'''The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:'''