Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
| Line 4: | Line 4: | ||
== Comparing methods for etching bulk glass at Danchip == | == Comparing methods for etching bulk glass at Danchip == | ||
Etching of Glass can be done either wet or dry. Wet etching is done with HF. Dry etching can be done either with [[Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch)|AOE]] using Flourine chemistry (only fused silica) or with [[Specific Process Knowledge/Etch/ | Etching of Glass can be done either wet or dry. Wet etching is done with HF. Dry etching can be done either with [[Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch)|AOE]] using Flourine chemistry (only fused silica) or with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions and/or using Flourine chemistry. | ||
At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat 33 (like pyrex)) and fused silica glass which in cleanliness is similar to quartz. Both types are etched wet in a special set-up placed in a fumehood using a strong HF-solution (isotropic etch). | At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat 33 (like pyrex)) and fused silica glass which in cleanliness is similar to quartz. Both types are etched wet in a special set-up placed in a fumehood using a strong HF-solution (isotropic etch). | ||