Specific Process Knowledge/Thin film deposition/Deposition of AZO: Difference between revisions
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* Carbon | * Carbon | ||
| | | | ||
* Silicon | *Silicon | ||
* Silicon oxide | *Silicon oxide, silicon nitride | ||
*Quartz/fused silica | |||
* | *Al, Al<sub>2</sub>O<sub>3</sub> | ||
* | *Ti, TiO<sub>2</sub> | ||
* | *Other metals (use dedicated carrier wafer) | ||
* | *III-V materials (use dedicated carrier wafer) | ||
* | *Polymers (depending on the melting point/deposition temperature, use carrier wafer) | ||
* | |||