Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions

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== Processing on the MVD ==
== Processing on the MVD ==


The MVD coatings are created as self-assembled monolayers on a surface when a molecular vapor of chemials is present. These chemicals typically have a teflon-like tail consisting of -(CF<sub>2</sub>)<sub>x</sub>CF<sub>3</sub> and, in the other end, a reactive group -SiCl<sub>x</sub>.
The MVD coatings are created as self-assembled monolayers on a surface when a molecular vapor of chemials is present.  


In most cases the chlorine atoms in the end of an flourinated organosilane react with -OH groups of the surface to form a chemical bond under elimination of HCL.
These chemicals, typically it is flourinated organosilanes, have a teflon-like tail consisting of -(CF<sub>2</sub>)<sub>x</sub>CF<sub>3</sub> and, in the other end, a reactive group -SiCl<sub>x</sub>. The chlorine atoms react with -OH groups of the surface to form a chemical bond under elimination of HCL.  


<gallery caption="Some chemicals of the MVD and the surface reaction" widths="200px" heights="150px" perrow="2">
<gallery caption="Some chemicals of the MVD and the surface reaction" widths="200px" heights="150px" perrow="2">

Revision as of 16:13, 3 April 2008

The Molecular Vapor Deposition Tool

The MVD is located in cleanroom 1

The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At Danchip the MVD is essential for nanoimprint lithography.

Processing on the MVD

The MVD coatings are created as self-assembled monolayers on a surface when a molecular vapor of chemials is present.

These chemicals, typically it is flourinated organosilanes, have a teflon-like tail consisting of -(CF2)xCF3 and, in the other end, a reactive group -SiClx. The chlorine atoms react with -OH groups of the surface to form a chemical bond under elimination of HCL.

The flat recipe
O2 plasma Flow 200 sccm
Power 250 Watts
Time 300 seconds
Chemical # 1 (vapor order 1) Name FDTS
Line no. 3
Cycles 4
Pressure 0.500 Torr
Chemical # 2 (vapor order 2) Name Water
Line no. 1
Cycles 1
Pressure 18 Torr
Processing Time 900 seconds
Purge Cycles 5