Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions

Revision as of 13:28, 17 January 2017

**Process runs**
Date	Substrate Information				Process Information				SEM Images
Date	Wafer info	Mask	Material/ Exposed area	Tool / Operator	Conditioning	Recipe	Wafer ID	Comments	SEM Images
2/12-2014	4" Wafer with travka50 mask	AZ standard	Si / 50 %	Pegasus/jmli	10 minute TDESC clean	danchip/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins	S004693	New showerhead

Revision as of 15:21, 16 January 2015 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary ← Older edit		Revision as of 13:28, 17 January 2017 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary Newer edit →
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	{\| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"		{\| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
	\|+ '''Process runs'''		\|+ '''Process runs'''