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Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide/By BGHE: Difference between revisions

Bghe (talk | contribs)
Bghe (talk | contribs)
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|<!--'''T'''--> 0
|<!--'''T'''--> 0
|<!--'''Process time'''--> 8min
|<!--'''Process time'''--> 8min
|<!--'''Comment'''-->  
|<!--'''Comment'''--> repeated s007416 and s007468 with a barc etch step. This improved the uniformity of the etch performance over different linewidth and improved the selectivity to the mask and the profile angle. AFter this I continued with barc etch.
|<!--'''Results'''-->
|<!--'''Results'''-->
[[File:ICP metal s007565_02.jpg|100px|frameless]] [[File:ICP metal s007565_06.jpg|100px|frameless]]
[[File:ICP metal s007565_02.jpg|100px|frameless]] [[File:ICP metal s007565_06.jpg|100px|frameless]]
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|<!--'''T'''--> 0
|<!--'''T'''--> 0
|<!--'''Process time'''--> 10min
|<!--'''Process time'''--> 10min
|<!--'''Comment'''-->  
|<!--'''Comment'''--> Repeated s007416 with double time.
|<!--'''Results'''-->
|<!--'''Results'''-->
[[File:ICP metal s007468_12.jpg|100px|frameless]] [[File:ICP metal s007468_15.jpg|100px|frameless]]
[[File:ICP metal s007468_12.jpg|100px|frameless]] [[File:ICP metal s007468_15.jpg|100px|frameless]]