Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide: Difference between revisions
Appearance
| Line 129: | Line 129: | ||
|- | |- | ||
|Etch rate of thermal oxide | |Etch rate of thermal oxide | ||
|'''145-172 nm/min''' ''by bghe@danchip (2015-06- | |'''145-172 nm/min''' ''by bghe@danchip (2015-06-02)'' | ||
|'''145 nm/min ''' ''by Martin Lind Ommen (fall 2016)'' | |'''145 nm/min ''' ''by Martin Lind Ommen (fall 2016)'' | ||
|- | |- | ||
| Line 161: | Line 161: | ||
|- | |- | ||
|Comments | |Comments | ||
| | |Sample: s007592 | ||
|See more result with hard masks in Process2share: [http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_SiO2] | |See more result with hard masks in Process2share: [http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_SiO2] | ||
|} | |} | ||