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Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide: Difference between revisions

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|-style="background:Gray; color:White"
|-style="background:Gray; color:White"
!Parameter
!Parameter
!Recipe on ICP metal: A SiO2 etch with C4F8 with resist mask
!Recipe on ICP metal: A SiO2 etch with C4F8 with resist mask@20dgC
!Recipe on ICP metal: A SiO2 etch with C4F8 with resist mask@20dgC
|-
|-
|Coil Power [W]
|Coil Power [W]
|1000
|1000
|1000
|-
|-
|Platen Power [W]
|Platen Power [W]
|200
|200
|200
|-
|-
|Platen temperature [<sup>o</sup>C]
|Platen temperature [<sup>o</sup>C]
|0
|20
|20
|-
|-
|C<sub>4</sub>F<sub>8</sub> flow [sccm]
|C<sub>4</sub>F<sub>8</sub> flow [sccm]
|10
|10
|10
|-
|-
|H<sub>2</sub> flow [sccm]
|H<sub>2</sub> flow [sccm]
|28
|28
|28
|-
|-
|Pressure [mTorr]
|Pressure [mTorr]
|2.5
|2.5
|2.5
|-
|-
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{| border="2" cellspacing="2" cellpadding="3"
{| border="2" cellspacing="2" cellpadding="3"
|-style="background:Black; color:White"
|-style="background:Black; color:White"
!Results  
!Results
!Test
!Test@20dgC  
!Test@20dgC  
|-
|-
|Etch rate of thermal oxide
|Etch rate of thermal oxide
|
|'''145 nm/min ''' ''by Martin Lind Ommen (fall 2016)''
|'''145 nm/min ''' ''by Martin Lind Ommen (fall 2016)''
|-
|-
|Selectivity to  resist [:1]
|Selectivity to  resist [:1]
| (SiO2:resist)
| (SiO2:resist)
|
|-
|-
|Cr etch rate
|Cr etch rate
|not tested
|1.6 nm/min (1:90 to SiO2) ''by Martin Lind Ommen (fall 2016)''
|1.6 nm/min (1:90 to SiO2) ''by Martin Lind Ommen (fall 2016)''
|-
|-
|Profile [<sup>o</sup>]
|Profile [<sup>o</sup>]
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|-
|Wafer uniformity map (click on the image to view a larger image)
|Wafer uniformity map (click on the image to view a larger image)
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|  
|  
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|-
|SEM profile images
|SEM profile images
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|-
|Etch rate in barc
|Etch rate in barc
|
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|-
|Etch rate in KRF resist
|Etch rate in KRF resist
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|Comments
|Comments
|
|See more result with hard masks in Process2share: [http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_SiO2]
|See more result with hard masks in Process2share: [http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_SiO2]
|}
|}