Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide: Difference between revisions
Appearance
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!Parameter | !Parameter | ||
!Recipe on ICP metal: A SiO2 etch with C4F8 with resist mask | |||
!Recipe on ICP metal: A SiO2 etch with C4F8 with resist mask@20dgC | !Recipe on ICP metal: A SiO2 etch with C4F8 with resist mask@20dgC | ||
|- | |- | ||
|Coil Power [W] | |Coil Power [W] | ||
|1000 | |||
|1000 | |1000 | ||
|- | |- | ||
|Platen Power [W] | |Platen Power [W] | ||
|200 | |||
|200 | |200 | ||
|- | |- | ||
|Platen temperature [<sup>o</sup>C] | |Platen temperature [<sup>o</sup>C] | ||
|0 | |||
|20 | |20 | ||
|- | |- | ||
|C<sub>4</sub>F<sub>8</sub> flow [sccm] | |C<sub>4</sub>F<sub>8</sub> flow [sccm] | ||
|10 | |||
|10 | |10 | ||
|- | |- | ||
|H<sub>2</sub> flow [sccm] | |H<sub>2</sub> flow [sccm] | ||
|28 | |||
|28 | |28 | ||
|- | |- | ||
|Pressure [mTorr] | |Pressure [mTorr] | ||
|2.5 | |||
|2.5 | |2.5 | ||
|- | |- | ||
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{| border="2" cellspacing="2" cellpadding="3" | {| border="2" cellspacing="2" cellpadding="3" | ||
|-style="background:Black; color:White" | |-style="background:Black; color:White" | ||
!Results | !Results | ||
!Test | |||
!Test@20dgC | !Test@20dgC | ||
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|Etch rate of thermal oxide | |Etch rate of thermal oxide | ||
| | |||
|'''145 nm/min ''' ''by Martin Lind Ommen (fall 2016)'' | |'''145 nm/min ''' ''by Martin Lind Ommen (fall 2016)'' | ||
|- | |- | ||
|Selectivity to resist [:1] | |Selectivity to resist [:1] | ||
| (SiO2:resist) | | (SiO2:resist) | ||
| | |||
|- | |- | ||
|Cr etch rate | |Cr etch rate | ||
|not tested | |||
|1.6 nm/min (1:90 to SiO2) ''by Martin Lind Ommen (fall 2016)'' | |1.6 nm/min (1:90 to SiO2) ''by Martin Lind Ommen (fall 2016)'' | ||
|- | |- | ||
|Profile [<sup>o</sup>] | |Profile [<sup>o</sup>] | ||
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|Wafer uniformity map (click on the image to view a larger image) | |Wafer uniformity map (click on the image to view a larger image) | ||
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|SEM profile images | |SEM profile images | ||
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|Etch rate in barc | |Etch rate in barc | ||
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| | | | ||
|- | |- | ||
|Etch rate in KRF resist | |Etch rate in KRF resist | ||
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|- | |- | ||
|Comments | |Comments | ||
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|See more result with hard masks in Process2share: [http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_SiO2] | |See more result with hard masks in Process2share: [http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_SiO2] | ||
|} | |} | ||