Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions
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|Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]]) | |Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]]) | ||
|Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
| Sputter deposition of NiV | |||
| Sputter deposition of NiV | | Sputter deposition of NiV | ||
|- | |- | ||
| Line 22: | Line 24: | ||
! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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|About 10Å to 5000Å | |About 10Å to 5000Å | ||
| | |||
|- | |- | ||
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|Depending on process parameters. | |Depending on process parameters. | ||
|Depending on process parameters. | |||
|- | |- | ||
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*1x4" wafer or | *1x4" wafer or | ||
*1x6" wafer | *1x6" wafer | ||
| | |||
*24x2" wafers or | |||
*6x4" wafers or | |||
*6x6" wafers | |||
|- | |- | ||
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* Silicon wafers | * Silicon wafers | ||
* Quartz wafers | * Quartz wafers | ||
* Pyrex wafers(No substrate heating) | |||
| | |||
* Silicon wafers | |||
* Quartz wafers | |||
* Pyrex wafers | |||
|- | |- | ||
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* Metals | * Metals | ||
* Carbon | * Carbon | ||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Comment | ! Comment | ||
| Sputter target with NiV composition: Ni/V 93/7% | |||
| Sputter target with NiV composition: Ni/V 93/7% | | Sputter target with NiV composition: Ni/V 93/7% | ||
|- | |- | ||
Revision as of 10:26, 2 January 2017
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Sputtering of Nickel Vanadium
Nickel Vanadium may be sputter deposited in either Sputter-system (Lesker)
In the chart below you can compare the different deposition equipment.
| Sputter deposition (Sputter-System Lesker) | Sputter deposition (Wordentec) | |
| General description | Sputter deposition of NiV | Sputter deposition of NiV |
| Pre-clean | RF Ar clean | RF Ar clean |
| Layer thickness | About 10Å to 5000Å | |
| Deposition rate | Depending on process parameters. | Depending on process parameters. |
| Batch size |
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| Allowed substrates |
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| Allowed materials |
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| Comment | Sputter target with NiV composition: Ni/V 93/7% | Sputter target with NiV composition: Ni/V 93/7% |