Specific Process Knowledge/Thin film deposition/Antistiction Coating: Difference between revisions
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It is critical that the chemicals with the lowest vapor pressure are injected first into the process chamber. If, for instance, water is injected before FDTS, the water will flow into the FTDS expansion volume and cause polymerization, thus forcing a mechanical clean. NOT GOOD!. | It is critical that the chemicals with the lowest vapor pressure are injected first into the process chamber. If, for instance, water is injected before FDTS, the water will flow into the FTDS expansion volume and cause polymerization, thus forcing a mechanical clean. NOT GOOD!. | ||
== The | == The FLAT2 recipe == | ||
=== Purpose === | === Purpose === | ||
The | The FLAT2 recipe is designed for quick coating of non-structured wafers. One should not expect to get good conformal coverage of nanostructures or nanometersized surface roughness. | ||
=== Process description === | === Process description === | ||
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== The | == The STAMP2 recipe == | ||
=== Purpose === | === Purpose === | ||
The | The STAMP2 recipe uses the same total amount of FDTS as FLAT but delivers it much slower in order to obtain a much better and conformal coating of fine nanostructures. STAMP2 should always be used for stamps for nanoimprint lithography irregardless of the feature size. | ||
=== Process description === | === Process description === | ||