Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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|'''Possible masking materials''' | |'''Possible masking materials''' | ||
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*LPCVD silicon (good adhesion and step coverage) | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|LPCVD silicon]] (good adhesion and step coverage) | ||
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*Sputtered silicon (Alcatel)(bad adhesion and step coverage) | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Sputtered silicon (Alcatel)]] (bad adhesion and step coverage) | ||
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|- valign="top" | |- valign="top" | ||