Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | ||